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DesignCon 2017

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Summary

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. Now in its 22nd year, DesignCon offers state-of-the-art design methodologies, applications and technologies, as well as unparalleled networking opportunities.

Details

HUBER+SUHNER, a sixth-time exhibitor at DesignCon, is using the event to unveil the newest addition of their multicoax series: MXPM, which features a coaxial-to-PCB transition of up to 85 GHz, ultra-dense channel pitch, a magnetic locking mechanism and automatic interface protection.

The company will also be showcasing its microwave assembly SUCOFLEX 500 portfolio, including the debut of two latest creations – the SUCOFLEX 526V and SUCOFLEX 526S. Also on display will be the Microbend L, the brand-new low loss assembly with increased phase stability and power handling capacity for use in low profile, point-to-point communications.

Curious? Visit booth no. 847 and meet our experts there!

Location

Santa Clara, Convention Center California

Date

01/02/2017 – 02/02/2017