Today’s energy metering, measuring and controlling devices are often built from several modules, boards or building blocks. This is mainly done to increase flexibility and for the easy customisation of products, which is often required due to legal differences in countries or differences in standards applying to operators or countries.
Since most devices have wireless or cellular connectivity, or required transmission of high data rates between boards, a highly flexible and low cost solution for transmitting RF signals between boards and/or building blocks is required.
Eliminating cabling to reduce costs is common in today’s industry. This may however increase mechanical stress significantly, especially since in most cases a solution for a mechanical overdetermined system needs to be provided. To overcome this, whilst continuing to maintain excellent electrical properties, board-to-board connectors need to be employed.
HUBER+SUHNER offers different board-to-board solutions (MMBX, MFBX and MBX) allowing board-to-board, board-to-panel, and board-to-board-through-panel connectivity. This technology brings features such as blind-mateability and large axial and radial working ranges.
Some products cannot be allocated in any of the three main lines. They are consolidated in the speciality cable line. It includes special designs like odd impedance, twinax or triax cables. A selection of low-noise coax and triax cables is also available. Cables with special qualification, for instance in accordance with railway norms like EN 45545 or in accordance with UL are also listed in this section.
HUBER+SUHNER MBX/MFBX/MMBX connectors are especially developed for board-to-board and board-to-module RF interconnections. The mechanical design is outstanding, allowing the MBX/MFBX/MMBX to cope with mechanical misalignment in radial and axial directions and still hold an excellent electrical performance. These series are the answer to higher integration and miniaturisation. They are the perfect solution for multiple connections from board-to-board and complex stack-ups in radio module applications.