| Interface side 1 | |
| Gender side 1 | |
| Standard side 1 | - HUBER+SUHNER MMPX STD (Patent US 7.294.023)
|
| Centre contact | - Copper Beryllium Alloy / Gold Plating (without Nickel underplating)
|
| Outer conductor | - Copper Beryllium Alloy / Gold Plating (Nickel underplated)
|
| Body | - Copper Beryllium Alloy / Gold Plating (Nickel underplated)
|
| Insulator | - PEEK (Polyether-etherketone)
|
| Interface side 2 | |
| Gender side 2 | |
| Standard side 2 | |
| Centre contact | - Copper Beryllium Alloy / Gold Plating (without Nickel underplating)
|
| Outer conductor | - Copper Beryllium Alloy / Gold Plating (without Nickel underplating)
|
| Body | - Copper Beryllium Alloy / Gold Plating (without Nickel underplating)
|
| Insulator | - PEEK (Polyether-etherketone)
|
