Semiconductor and high-speed digital testing
Test & Measurement
HUBER+SUHNER empowers innovation with advanced semiconductor & high-speed digital testing (HSDT) solutions for laboratories in the most demanding operational environments- ultra-precise, efficient and customized. This includes expert technical support, 3D file libraries, electrical modelling data and customer-specific footprints.
What support do we offer?
Service and support from HUBER+SUHNER involve customized and optimized board connector footprints. Three-dimensional electromagnetic field simulators demonstrate to customers the optimal performance of their board connectors.
Semiconductor & high-speed digital testing (HSDT) demands several different requirements, which HUBER+SUHNER meets. These solutions include high-speed digital chip verification, benchtop testing to check for the best signal integrity performance, PCB connectivity closest to the device under test, and more.
Secondly, testing solutions offer high-speed digital hardware and system verification, including multicoax connectivity between systems and modules with customized solutions.
Is your connector performing at your desired frequency range?
Any changes in the stack-up including dielectric material (Dk, Tan D), substrate thickness and metallization thickness can have a significant impact on connector performance. Connector footprints with optimized signal transmissions at the transition to the board, can avoid any unwanted reflection or resonances that might limit electrical performance.
In partnership with ANSYS INC, HUBER+SUHNER now offers customers encrypted HFSS 3D component models for our single and multi-coax PCB connector portfolio.
We will gladly assist you. Send us a message or find your local contact: